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Systems, Methods and Apparatus for Heatsink Grounding/Electromagnetic Compatibility

IP.com Disclosure Number: IPCOM000019890D
Original Publication Date: 2003-Oct-07
Included in the Prior Art Database: 2003-Oct-07

Publishing Venue

IBM

Abstract

Proper heatsink grounding is becoming a challenging issue as physical dimensions of computer systems and components continue to decrease. This invention reduces the amount of planar board surface area required by introducing a precision heatsink grounding device fashioned not unlike a "pogo pin". The "pogo pin" is a very precise instrument allowing repeatable accuracy for variations in the "Z" dimension. Multiple "pogo pins" are mechanically fastened and positioned around the heatsink base. Traditional heatsink grounding methods require large grounding pads on the planar due to a lack of precision in the grounding mechanism. This invention of using "pogo pins" on a heatsink base allows precise alignment with much smaller than normal grounding pads on a planar.