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Water-filled copper bladder for cooling high-density electonic hardware

IP.com Disclosure Number: IPCOM000020009D
Original Publication Date: 2003-Oct-17
Included in the Prior Art Database: 2003-Oct-17

Publishing Venue

IBM

Abstract

This invention solves the problem of cooling multiple closely spaced electronic modules, stacked parallel to each other, by inserting water-filled copper bladders that are squeezed between the modules.