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Method to create a contact on the edge of a flip-chip IC package

IP.com Disclosure Number: IPCOM000020155D
Publication Date: 2003-Oct-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to create a contact on the edge of a flip-chip integrated circuit (IC) package. Benefits include improved functionality and increased contact without a commensurate increase in substrate size.