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Reducing PCB Size by Stacking Packages

IP.com Disclosure Number: IPCOM000020167D
Publication Date: 2003-Oct-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of reducing PCB board size by stamping cavities in standard cavity-down QFP heat spreaders, and inserting small BGA and/or CSP packages inside the cavity beneath the QFP package. Benefits include reducing board size and using existing equipment and processes.