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Underfill Sheet with Embedded Conductive Cu-Au Balls for Substrate and Die Joint

IP.com Disclosure Number: IPCOM000020168D
Publication Date: 2003-Oct-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for embedding Cu-Au balls along the bump pitch inside an underfill sheet between the die and substrate join, connecting the die and substrate with a bumpless structure. Benefits include improving process yield, and reducing material and process costs.