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Disclosed is a method that uses a stiffening device that can be placed near a package or component. Benefits include reducing board flexure and maintaining reliability and mechanical integrity.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
Local Stiffening Device for Motherboards
Disclosed is a method that uses a stiffening device that can
be placed near a package or component. Benefits include reducing board flexure
and maintaining reliability and mechanical integrity.
Currently, board flexure problems are sometimes solved by
using a cumbersome, retention mechanism (see Figure 1), coupled with a backing
plate on the back side of the board.
An example of the disclosed method is shown in Figure 2. It
consists of a stiffener body made of a rigid material (e.g. metal, plastic,
etc) and a method of tightly coupling the stiffener to the board. The stiffener
surrounds the desired component and locks onto the motherboard through the use
of anchors (e.g. clips or wave solder posts) or adhered to the board by an
epoxy. The primary concern is that the stiffener is securely attached to the
board so that any flexure of the board will be resisted by the stiffener body
The following are advantages of the disclosed method:
the rigidity of the motherboard in the vicinity of the package with
minimal impact to volumetric “keep out” zones.
the installation of a heat sink, independent of the stiffener.