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Rapid Curing Epoxy Resin Dielectric Film for Substrates Prepared by Hot Embossing

IP.com Disclosure Number: IPCOM000020304D
Publication Date: 2003-Nov-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a rapid curing epoxy resin formulation that achieves a high level of cure under typical hot embossing conditions. Benefits include reduced hot embossing time and reduced post-embossing cure time, as well as reduced process costs.