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Controlling Solder TIM Bond Line Thickness by Substrate Reference Design and Solder Sealant

IP.com Disclosure Number: IPCOM000020305D
Publication Date: 2003-Nov-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that controls solder TIM bond line thickness by using the same solder material (or different solder materials with a lower melting temperature than the solder TIM materials) to automatically accomplish the substrate reference design. Benefits include improving solder TIM reliability, achieving stable solder TIM bond line thickness and eliminating sealant delamination.