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Application of a Wire Bondable Flex Tape BGA Package to High Speed Devices

IP.com Disclosure Number: IPCOM000020306D
Publication Date: 2003-Nov-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an extension of an existing flex tape BGA package; the disclosed method uses a cavity-down, two layer stack up on a die-up (i.e. cavity-up) package configuration. Benefits include enhancing thermal performance and eliminating the need for vias for the signal I/O connection.