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Disclosed is a method for cooling the backside of a desktop motherboard while providing mechanical support. Benefits include improved functionality and improved performance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
66% of the total text.
Method for cooling the backside of a desktop motherboard
while providing mechanical support
Disclosed is a method for cooling the backside of a desktop
motherboard while providing mechanical support. Benefits
include improved functionality and improved performance.
As power increases in the processor, the ohmic self-heating of
the printed circuit board (PCB) increases. This increase exceeds 100° C above
130W of power, forcing the PCB to require a thermal solution. The application
of a thermal solution to cool the bare PCB is expected to be accompanied by a
massive thermal solution for the chipset and the CPU. These two components may
exceed 550 grams in weight.
Conventionally, PCBs are not cooled.
The disclosed method places a solder heatsink inside a chassis
that conducts heat from the backside of the motherboard. The heatsink acts as a
mechanical support as well as a thermal solution for cooling the PCB.
The key elements of the method include:
The disclosed method
provides advantages, including:
• Improved functionality due to enabling
thermal cooling of a PCB that is subject to ohmic-self-heating
• Improved performance due to transferring
heat to the thermal solution through the pads located on the bottom of the PCB
The disclosed method conducts heat into the heatsink and down
to the bottom of the thermal solution. Tabs on the bottom of the
heatsink are soldered to the PC...