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Method for a thin-film deposited device on package substrates and PCBs for high accuracy measurements

IP.com Disclosure Number: IPCOM000020316D
Publication Date: 2003-Nov-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thin-film deposited device on package substrates and printed circuit boards (PCBs) for high accuracy measurements. Benefits include improved functionality and improved performance.