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Method for a ground plane on FS-CSP and BGA packages

IP.com Disclosure Number: IPCOM000020396D
Publication Date: 2003-Nov-19

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a ground plane on folded stacked chip-scale package (FS-CSP) and ball-grid array (BGA) packages. Benefits include improved functionality and improved performance.