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Multiple embedded passive devices into plated through holes of Printed Circuit Board Disclosure Number: IPCOM000020531D
Original Publication Date: 2003-Nov-26
Included in the Prior Art Database: 2003-Nov-26

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Disclosed is a method on forming multiple discrete devices (resistors, capacitors, inductors) in one plated-thru hole so that they are placed optimally in a performance point of view on a PCB (printed circuit board). The invention consists in filling the plated thru-hole with one or several materials having appropriate properties in order to create different value of reference (Ohm, Farad, Henry).