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Interferometric thickness-measurement of non-transparent lithographically structured layers

IP.com Disclosure Number: IPCOM000020742D
Original Publication Date: 2003-Dec-11
Included in the Prior Art Database: 2003-Dec-11

Publishing Venue

IBM

Abstract

Disclosed is a method to measure the thickness of non-transparent structures on a lithographical structured wafer without need to remove the transparent photoresist layer.