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Self-Healing Underfill Material

IP.com Disclosure Number: IPCOM000021035D
Publication Date: 2003-Dec-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that disperses a fine mix of monomer-filled capsules in the underfill matrix material. The capsules break when they come in contact with a fillet crack, and the resulting polymerization "heals" the crack.