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Second-Level Heat Sink with Package Warp Compensation

IP.com Disclosure Number: IPCOM000021038D
Publication Date: 2003-Dec-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a second-level heat sink with a bottom surface that mirrors the surface/warpage of the package; this heat sink design creates a uniform TIM thickness or a thinner TIM Bond Line Thickness (BLT). Benefits include reduced thermal resistance through to the heat sink.