Browse Prior Art Database

Method for wafer bow and stress measurement on patterned production wafer via line scan using a film thickness tool

IP.com Disclosure Number: IPCOM000021241D
Publication Date: 2004-Jan-07

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for wafer bow and stress measurement via line scan using a film thickness tool. Benefits include an improved functionality and improved reliability.