PROBE- TIP IMPROVEMENT FOR SEMICONDUCTOR WAFER TESTING
Original Publication Date: 2000-Nov-01
Included in the Prior Art Database: 2004-Jan-16
Sony Technical Digest
In semiconductor wafer testing operations, a persistent problem is the formation of the aluminum dioxide (A102) layer on the surface of the electrically conductive aluminum die bonding-pads. The aluminum dioxide layer covers and interferes with the bonding-pads, and in order to have effective electrical contact with the test-pad, the needle's probe-tip needs to break through the layer of aluminum dioxide.