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Method for a venturi-cooled heatsink with vortex spot cooling and directed exhaust on a die substrate package

IP.com Disclosure Number: IPCOM000021634D
Publication Date: 2004-Jan-28

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for venturi-cooled heatsink with vortex spot cooling and directed exhaust on a die substrate package. Benefits include improved functionality, improved performance, and improved reliability.