Browse Prior Art Database

Method for silkscreen patterns on PCBs to create reliable CSP solder joints

IP.com Disclosure Number: IPCOM000021635D
Publication Date: 2004-Jan-28

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for silkscreen patterns on printed circuit boards (PCBs) to create reliable chip-scale package (CSP) solder joints. Benefits include improved functionality and improved performance.