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Method for Attaching a Heat Spreader to IC Package Utilizing a Copper Carrier Plate

IP.com Disclosure Number: IPCOM000021637D
Publication Date: 2004-Jan-28

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for attaching an integrated heater spreader (IHS) to an IC package utilizing a Cu carrier plate. Benefits include elimination of substrate carrier and reduction in manufacturing cost.