Thermal Adhesives as Replacements to Mechanical Fasteners in Power Electronics
Publication Date: 2004-Feb-16
The IP.com Prior Art Database
In today's competitive environment, manufacturers need to find out innovative ways to meet market demands of high power densities in shrinking enclosure sizes. These demands require efficient designs for heat transfer and its dissipation, for product life and reliability. Reduction in overall dimensions of enclosures requires engineers to work at higher component frequencies and hence higher power dissipation per unit area. In order to take care of component life when its operating at high cycles per minute, heat needs to be taken out quickly and effectively.