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Liquid cooling of a multitude of closely spaced planar electronic modules housed between parallel metal plates

IP.com Disclosure Number: IPCOM000021957D
Original Publication Date: 2004-Feb-17
Included in the Prior Art Database: 2004-Feb-17

Publishing Venue

IBM

Abstract

The invention accomplishes the liquid cooling of a multitude of closely spaced planar electronic modules, housed between parallel metal plates, by sealing the space between the metal plates of adjacent electronics modules and pumping coolant through the space between the plates. The gaskets used to seal the parallel plates are specially shaped to provide a coolant-leak detection mechanism.