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Method for micromechanical drilling of microvias in multilayered, high density organic substrates

IP.com Disclosure Number: IPCOM000022002D
Publication Date: 2004-Feb-18

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for micromechanical drilling for microvias fabrication in multilayered, high density integration substrates. Benefits include improved performance and improved reliability.