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Method for metal-balancing stud features for improved adhesion between stacked die using a wafer level redistribution layer

IP.com Disclosure Number: IPCOM000022270D
Publication Date: 2004-Mar-03

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for metal-balancing stud features for improved adhesion between stacked die using a wafer level redistribution layer. Benefits include improved functionality and improved performance.