Inkjet Patterning Followed by Selective Curing
Publication Date: 2004-Mar-15
The IP.com Prior Art Database
From: Nigel Bromley [firstname.lastname@example.org]
Sent: 10 December 2003 08:20
Subject: Inkjet patterning followed by selective curing (re-send)
This idea was elaborated at a meeting consisting of: Christoph Bittner,
Martin Gouch and Nigel Bromley. It is for consideration of patenting or
Inkjet patterning followed by selective curing
This idea is a new method for patterning a functional layer in which the
different advantages of known methods are combined to produce a process
which is both fast and high-resolution.
The process is described in terms of patterning a solder resist layer on an
electronic circuit board, but it is applicable to many patterning processes.
Prior art is seen for patterning solder resist using an inkjet printer. In
this process, the required resist pattern is converted into a rasterised
image which is then printed over the whole area of the circuit board layer
using a resist material adapted for inkjet printing. This process is
suitable for prototyping or small volume production as it is reasonably fast
and economical with materials, but at present it is not capable of high
resolution. This is because of the rasterisation and the unpredictable
behaviour of the printing heads and of the ink on the surface.
The new process employs the following steps:
Print the required pattern of functional material (eg solder resist)
using conventional inkjet printing, allowing the ink to cover a slightly
larger area than required, at least in areas that are to be patterned more
accurately in the next step. At this stage, the ink is not fully cured, but
only cured sufficiently to stop it from spreading further. This pinning cure
either makes a thin skin or makes the bulk of the ink more viscous, but does
not solidify it.
Use an XY-adressable laser at a suitable wavelength to fully cure
the ink along the edges of...