Browse Prior Art Database

Thermal Hood: A Low Cost Thermal Chamber

IP.com Disclosure Number: IPCOM000022527D
Original Publication Date: 2004-Mar-19
Included in the Prior Art Database: 2004-Mar-19

Publishing Venue

IBM

Abstract

An alternative to a stand-alone Thermal Chamber is the Low Cost, Light Weight, Thermal Hood that allows a thermally controlled environment for thermal (heat) stressing any object that generates heat in some fashion. The achieved goal is to elevate the machine to a temperature above ambient for extended periods of time enabling thermal stress to be added to the normal test cycles. Our specific application is to create a device which would allow a machine (in this case, a 2105 Storage Subsystem - 'Shark Box') to be tested at an elevated temperature by re-circulation of its own hot air exhaust, and controlled by regulating the escape of that exhaust air into the surrounding room. This is an inexpensive, yet effective, way to perform an elevated temperature test without an additional exterior heat source e.g. running the machine in a thermal chamber. In fact, no extra power is required to thermally stress the product, and there is little to no additional floor space required.