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Bevel-Shaped Through-Hole Mount Solder Fillet

IP.com Disclosure Number: IPCOM000022663D
Publication Date: 2004-Mar-24

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that creates a bevel-shaped opening on the through hole at the bottom of a PCB. Benefits include improving wave fluxing efficiency and wave solder penetration into the through hole.