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Disclosed is a method that achieves high-Q passive component (i.e. embedded inductor) arrays for RF packaging. Benefits include a solution with no additional costs or manufacturing processes.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
53% of the total text.
Folded High-Q Spiral Inductor Array
Embedded in a Multi-Layer Substrate
Disclosed is a method that achieves high-Q passive component
(i.e. embedded inductor) arrays for RF packaging. Benefits include a solution
with no additional costs or manufacturing processes.
The Q-factor of a system is directly related to the
inductance value of the components built on a substrate. Current inductor
designs are based on how to maximize the overall inductance value with respect
to geometrical parameters (i.e. trace length, width, and spacing). Given the limited
space, advanced design topologies are created for the passive components.
Current multiple turn inductors are fabricated on a
substrate (see Figure 1). Inductors with a spiral turn (either circular or
rectangular) are the most common to achieve high inductance values. Optimizing
for geometrical parameters can improve the inductance to obtain a high Q-factor
for a system; however, another critical parameter that affects the overall
inductance is the mutual inductance between traces. High mutual inductance is
due to the narrow spacing between trace lines. Therefore, it is very important
to minimize the mutual inductance to increase the overall inductance of the
The disclosed method achieves high-Q passive component
arrays for RF packaging by introducing a shielding ground plane to reduce the
mutual inductance of trace lines. Trace lines with opposite current flow
directions are separated into...