Browse Prior Art Database

Protective Layer for Via Formation

IP.com Disclosure Number: IPCOM000022694D
Publication Date: 2004-Mar-25
Document File: 1 page(s) / 22K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method of protecting the electrical circuitry on a wafer during via formation for an ink jet printhead is proposed. A polymer protective layer is coated to protect the wafer during via formation and is then removed with solvents at the conclusion of the via formation process.