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PROCESS FOR DEPOTTING POTTED CIRCUITS

IP.com Disclosure Number: IPCOM000023509D
Original Publication Date: 1977-Dec-31
Included in the Prior Art Database: 2004-Mar-31

Publishing Venue

Xerox Disclosure Journal

Abstract

Electronic circuits are frequently encapsulated in a potting compound. When these circuits fail, access to circuit compo-nents may be made available by: (1) melting out the compound in an oven or the like; (2) subsequently washing the circuit in an ultrasonic turpentine bath; and (3) washing and rinsing the circuit in isopropyl alcohol to remove turpentine residue, Once access to the circuit components has been made available, soldering techniques may be used to replace faulty components and repotting can be undertaken.