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Pumped Fluid Spreaders for Hot Spot and System Cooling in Mobile Devices

IP.com Disclosure Number: IPCOM000023813D
Publication Date: 2004-Mar-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a pumped liquid metal loop embedded in a thin metal plate to cool hot-spots in mobile device applications. Benefits include a solution that is thin, light, and allows for lower casing temperatures and better thermal performance.