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Method for a flip-chip package with Cu tapers and a socket with soft solder coated holes for the package and MB assembly

IP.com Disclosure Number: IPCOM000023823D
Publication Date: 2004-Mar-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a flip-chip package with Cu tapers and a socket with soft solder coated holes for the package and motherboard (MB) assembly. Benefits include improved functionality, improved performance, and improved environmental friendliness.