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Anti-Slip Design for Offset Die Stacking Using a Wafer-Level Redistribution Layer

IP.com Disclosure Number: IPCOM000023834D
Publication Date: 2004-Mar-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that helps prevent silicon die from slipping when paste die attach materials are used to attach two pieces of silicon that are not perfectly centered over one another.