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Disclosed is a method that helps prevent silicon die from slipping when paste die attach materials are used to attach two pieces of silicon that are not perfectly centered over one another.
English (United States)
This text was extracted from a Microsoft Word document.
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100% of the total text.
Anti-Slip Design for Offset Die Stacking
Using a Wafer-Level Redistribution Layer
Disclosed is a method that helps prevent silicon die from
slipping when paste die attach materials are used to attach two pieces of
silicon that are not perfectly centered over one another.
Die slip has been experimentally determined to happen not
only with silicon die but with other materials. Slip happens when two materials are stacked using a liquid or
paste adhesives and the top piece is placed off-centered over the bottom piece
(see Figure 1). Capillary forces act to
re-center the top piece over the bottom piece prior to adhesive cure.
The disclosed concept involves incorporating anti-slip
features on top of the silicon die to counter or slow the effect of capillary
forces acting on the top silicon die (see Figure 2). These forces act to re-center the top piece of the bottom piece
prior to loading the units in the oven to lock and cure the adhesive.
The disclosed concept allows for more die attach working
time before having the load the offset stacked units into the cure oven.