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Disclosed is a method that embeds a heat spreader on a package's surface during the molding process. Benefits include improving thermal performance, assembly yield, and manufacturing throughput.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
72% of the total text.
Thermal Performance Enhancements for
Small Form Factor Flip Chip Packages
Disclosed is a method that embeds a heat spreader on a
package’s surface during the molding process. Benefits include improving
thermal performance, assembly yield, and manufacturing throughput.
Currently, it is difficult to improve the thermal
performance of flip chip packages. In
order to enhance thermal dissipation, an external heat sink or integrated heat
spreader (IHS) is used, which requires expensive thermal interface greases, and
additional processes for the IHS assembly (see Figure 1). For low cost flip
chip options, the external heat sink increases costs for the assembly
processes. In addition, the die can be
easily damaged during the heat sink attachment and curing processes.
In most cases, the area molded flip chip packages are
usually encapsulated by using a molding technology with or without underfilling
material. The die backside can be either exposed or covered by a low thermal
In the disclosed method, an embedded IHS is attached to the
substrates, and then the molding material is injected to finish the molding
process (see Figure 2). The underfilling process is included or eliminated from
the process. Alternately, the IHS shape can be designed so that the air easily
escapes during the molding process. The IHS can be attached to the die backside,
or can simply float on the molding compound (see Figure 3). If the IHS is attached to...