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Thermal Loading Land Grid Array with Heat Sink Posts to Stiffen the PCB

IP.com Disclosure Number: IPCOM000023836D
Publication Date: 2004-Mar-31

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a heat sink with attached posts to stiffen a PCB under the CPU and socket. Benefits include eliminating the need for a backing plate under the PCB.