Browse Prior Art Database

INJECTION MOLDED HIGH VOLTAGE POWER SUPPLY NETWORK

IP.com Disclosure Number: IPCOM000024254D
Original Publication Date: 1980-Feb-29
Included in the Prior Art Database: 2004-Apr-02

Publishing Venue

Xerox Disclosure Journal

Abstract

High voltage power supply networks packaged by injection molding a plastic material offer several advantages over conventional epoxy sealed networks. Injection molding provides a herme tically sealed unit which exactly positions and supports the network components (capacitors, resistors and diodes), component interconnections, and electrical interface connectors. Exact positioning of the network com ponen ts, interconnections, and connectors at predetermined distances from each other maintains the corona level at a low, predictable, constant value from one internal point to the next over large volume production with no impact on that level due to humidity, altitude, dirt, or other unfavorable environmental conditions. The controlled corona level permits the network package volume to be reduced by an order of two when compared to conventional epoxy packaging.