HIGH DENSITY ELECTRICAL CONNECTIONS TO GLASS SUBSTRATES
Original Publication Date: 1980-Oct-31
Included in the Prior Art Database: 2004-Apr-02
Xerox Disclosure Journal
In liquid crystal matrix address systems having a separate electronic drive package, a large number of electrical connections in a small length, such as 120 connections per inch, must be made. This can be achieved by the configuration shown in the above figure wherein a copper coated, flexible circuit was placed in direct contact with an indium tin oxide coated glass substrate.