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METHOD OF FORMING A HIGH DENSITY ELECTRICAL CIRCUIT AND INTERCONNECTS THERETO

IP.com Disclosure Number: IPCOM000025080D
Original Publication Date: 1983-Aug-31
Included in the Prior Art Database: 2004-Apr-04

Publishing Venue

Xerox Disclosure Journal

Abstract

The electrical connection of one point in an electronic device to some other point is accomplished by a variety of means and over a wide range of densities. In the microelectronics art, these electrical interconnect methods include a point-to-wiring, conventional (and increasingly unconventional) printed circuit boards, thick and thin film hybrid circuits, redundant and non-redundant elastomeric conductors, and mask defined metallization patterns executed at chip level. With the increasing complexity of integrated circuits and other electronic devices, there has arisen a need to provide interconnecting conductor patterns with increasingly high densities. Meeting this objective exceeds or strains the capabilities of the foregoing technologies. Efforts to provide truly high resolution, or fine line geometries, also necessarily raise concomitant problems of providing commercially feasible means of electrically interconnecting the dense conductors to other system components as, for example, to associated driver circuits.