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SEMICONDUCTOR LASER BODY HEAT SINK

IP.com Disclosure Number: IPCOM000025533D
Original Publication Date: 1985-Dec-31
Included in the Prior Art Database: 2004-Apr-04

Publishing Venue

Xerox Disclosure Journal

Abstract

Headers for support and heat sinking of semiconductor lasers are generally fabricated of copper. The laser is mounted I'P side" down to make effective use of the heat sink. The soldering of the laser to the heat sink is critical for mainly two reasons: (I) to ensure that areas of the I'P side" are uniformly in engagement with the heat sink to eliminate hot spots and (2) to align the front mirror facet of the laser with the front edge of the copper heat sink.