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POST ASSEMBLY CONTACT BUMP FABRICATION FOR FACILITATING ASSEMBLY OF MOSAIC THERMAL PRINTBARS

IP.com Disclosure Number: IPCOM000025560D
Original Publication Date: 1986-Apr-30
Included in the Prior Art Database: 2004-Apr-04

Publishing Venue

Xerox Disclosure Journal

Abstract

To improve the fabrication yield of large marking transducer arrays for electronic printing applications, such as thermal printers, it can be more economical to follow a mosaic assembly approach, where several marking transducer array modules are precisely aligned and mounted (butted) end-to-end. While page-width thermal printbars are presently being developed and manufactured, the mosaic approach may become even more advantageous as the transducer density rises beyond 300 per inch. Precision alignment and mounting requirements may be relaxed by defining the transducer position with a thermal contact bump applied after assembly.