Browse Prior Art Database

Original Publication Date: 1991-Feb-28
Included in the Prior Art Database: 2004-Apr-05

Publishing Venue

Xerox Disclosure Journal


Figure 1 shows a side view and Figure 2 shows a top view of an interconnection method and construction of a subunit which satisfies the electrical re-interconnection requirement for replacing defective subunits using a spring loaded configuration citing electrical re-interconnection as a major challenge. The subunit consists of a keyed RIS (not shown) or ROS module 10 with electrical connection made to chip metallic bonding pads 22 using Tape Automated Bonding (TAB) methods and materials. TAB portion 18 of module 10 consists of an array of conductors 16 fixed within an organic carrier film 14. the ends of one side of each conductor 16 are cantilevered from the carrier material to enable bonding to bonding pads 22 (typically by a thermocompression process) of semiconductor chip 26. The remaining ends of conductors 16 terminate in a row on carrier material 28. Electrical connection between module 10 and the large substrate (not shown) can be made via a pressure contact scheme. The carrier fixed ends of conductors 16 can also be embossed to raise metallic bumps 12 in enhancing the reliability of the connection. If the carrier material proves to be too flimsy, a stiffer material (i.e. printed circuit board material) can be laminated to TAB portion 13 of module 10. Alignment of the bumped end of conductor 16 to the large area substrate can be achieved by incorporating alignment holes 24 in the bumped end of conductor 16 and corresponding alignment pins in the large area substrate. With the entire module aligned and in place upon the large area substrate, a spring loaded clip or other mechanism can be activated to hold the now replaceable module 10 in place.