Browse Prior Art Database

WIRE BOND ENCAPSULATION METHOD FOR FULL WIDTH SEMICONDUCTOR ARRAYS

IP.com Disclosure Number: IPCOM000026557D
Original Publication Date: 1992-Oct-31
Included in the Prior Art Database: 2004-Apr-06

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed herein is an ecapsulation method for providing wire bond corrosion protection on full width photo sensor chip arrays. A general configuration of a full width array image input device, commonly referred to as a "Scanner Bar", is shown in Figure 1. Full width array 10 consists of butted silicon chip array 20 having photosites 30 near one edge, that are mounted on substrate 40. A rigid interconnect strip 50 with electrical connector 60, generally composed of epoxy-glass printed wire board, is also mounted on substrate 40. Figure 3A shows butted silicon chip array 20 in more detail, with photosites 30 near one edge of chip array 20 and wires 70 at the other. Wires 70 bond to rigid interconnect strip 50 for communication with devices outside the full width array 10.