PLUNGE CUTTING OF BONDED SILICON WAFERS
Original Publication Date: 1994-Oct-31
Included in the Prior Art Database: 2004-Apr-07
Xerox Disclosure Journal
It is very difficult to achieve micron level cut placement accuracy while cutting bonded silicon wafers into a plurality of individual thermal ink jet printheads. The angle at which the blade approaches the silicon wafer changes as a function of the cut position around the circumference of the wafer. The blade bends proportionally towards the obtuse angle between the blade and silicon wafer. Current practice is to reduce the depth of cut and utilize multiple passes which is time consuming and puts additional constraints on realignment and step accuracy.