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A PROCESS FOR LAMINATION OF NICKEL SCREEN TO THE BONDED CHANNEL WAFER IN PRINTHEAD MANUFACTURE

IP.com Disclosure Number: IPCOM000027316D
Original Publication Date: 1996-Apr-30
Included in the Prior Art Database: 2004-Apr-07

Publishing Venue

Xerox Disclosure Journal

Abstract

During the assembly of thermal ink jet devices, a nickel screen is placed on top of the channel wafer after it has been bonded to the heater wafer and before individual dies are diced from the laminate. The individual dies are then bonded to the ink reservoir and the addressing electronics in order to obtain fully functional printheads. The primary reason for the presence of nickel screen in this case is to prevent the flow of debris in the ink from the ink reservoir to the channels. Were that to happen, the channels would, in all likelihood, get blocked, and would, as a result, not be able to deliver ink to the paper. This would lead to a loss in print quality. By the same token, any kinks in the very fine nickel screen would also lead to a similar loss in print quality. However, in this latter case the reason would be the lack of flow of the ink from the reservoir to the channels rather than the blockage of the channels by the debris in the ink as in the previous case. Thus, a mechanical and operator independent process for the lamination of the nickel screen to the channel plate, after the latter has been bonded to the heater plate, is required so that a smooth and kink free lamination is achieved every time.