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ORGANOSILICON POLYMER FOR THERMAL INK JET PRINTHEAD

IP.com Disclosure Number: IPCOM000027428D
Original Publication Date: 1996-Dec-31
Included in the Prior Art Database: 2004-Apr-07

Publishing Venue

Xerox Disclosure Journal

Abstract

The heater wafer of some Thermal Ink Jet (TIJ) printheads include a polyimide photoresist barrier layer. This polyimide layer has inadequate hydrolytic stability to withstand the organic solvents and the alkaline nature of TIJ ink formulations. Poly(p-methoxybenzylsilsesquioxane) is a double chain or ladder organosilicon polymer that can be cast as a film from solution and then patterned by reactive ion etching using a fluorinated gas such as C2F6, CF4, or SF6 and O, gas and an appropriate mask. Removal of the mask and treatment of the entire surface with an oxygen Reactive Ion Etch (RIE) forms a passivating Si02 layer on the upper surface.