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PHOTOPATTERNED INK INLET SEAL WITH OPTIONAL FILTRATION CAPABILITY

IP.com Disclosure Number: IPCOM000027452D
Original Publication Date: 1997-Feb-28
Included in the Prior Art Database: 2004-Apr-08

Publishing Venue

Xerox Disclosure Journal

Abstract

Proposed is the use of a photopatternable adhesive, such as Parad@, to form an ink-tight seal between thermal ink jet die modules and the ink delivery system. An ink fitration capability can be optionally patterned into the material. The photopatternable dry film adhesive can withstand chemical attack by a wide variety of thermal ink jets.