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MARKING SYSTEM FOR WAFER LOCATION IDENTIFICATION IN A THERMAL INK JET PRINTHEAD

IP.com Disclosure Number: IPCOM000027503D
Original Publication Date: 1997-Jun-30
Included in the Prior Art Database: 2004-Apr-08

Publishing Venue

Xerox Disclosure Journal

Abstract

Proposed is a method of coding thermal ink jet die for identification. The method uses etched features visible from the edge of a bonded and diced silicon printhead structure. Orientation Dependent Etch (ODE) channels form binary-coded information that appear as small triangles at the edge of the die. The coding allows for nondestructive identification of the die configuration or wafer location. Such identification simplifies the assembly of developmental devices and provides access to additional information for process control.