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NICKEL SLEEVED LOADING PIN

IP.com Disclosure Number: IPCOM000027583D
Original Publication Date: 1998-Feb-28
Included in the Prior Art Database: 2004-Apr-08

Publishing Venue

Xerox Disclosure Journal

Abstract

Disclosed is an apparatus for loading electroformed substrates. The design is shown in the accompanying figure and comprises a Lexanm pin 20 attached to a base plate 10. An undersized electroformed nickel sleeve 22 having a wall thickness of approximately 0.002 inches and an ellipsoid end is lightly pressed over pin 20. The pin 20 provides a structural support under sleeve 22 and allows for easy attachment to base 10. Furthermore, the pin decreases the weight of the assembly on which an electroformed substrate 30 is loaded, in a clean room environment. The sleeve 22 prevents skiving of pin 20 by the substrate by