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THERMAL INTERFACE PAD ON REMOVABLE PRINTHEAD TO IMPROVE HEAT TRANSFER TO PRINTER

IP.com Disclosure Number: IPCOM000027639D
Original Publication Date: 1998-Jun-30
Included in the Prior Art Database: 2004-Apr-08

Publishing Venue

Xerox Disclosure Journal

Abstract

A thermal interface pad can be applied to a removable printhead in order to improve the thermal transfer to a printer mounted, non-removable, heat sink. The pad would be applied with a pressure sensitive interface during manufacturing. A release liner (film) is removed by the customer at time of printhead installation. The pad will conform to irregularities of surfaces allowing for mating of rougher surfaced parts. The printhead is held in place with low force mechanical clip. This pad would improve thermal transfer without the use of wet greases by a customer in the field.